一、接口示意图

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二、端口描述

2.1、LVDS 接口

LVDS 支持 4 Lane和8 Lane 屏，LVDS屏电源接口有12V、5V、3.3V之间选择。

2.11： LVDS 屏电源选择，可以通过跳线帽选择合适LVDS屏规格的电源

2.12： LVDS 接口定义，连接器为2*15Pin 2.0MM间距针座。

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2.2、 LVDS /EDP电源背光

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2.3、 EDP接口

2.31： EDP 接口连接器为2*10Pin 2.0MM间距针座。其接口定义为：

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2.3： EDP 电源 可以通过 R2902和R2903来切换 3.3V或5V供电。

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2.4、 Camera for MIPI CSI

支持2路 2Lane MIPI摄像头，也可以组合成 4 Lane 单路摄像头使用。

摄像头使用的是24Pin 0.5mm 间距的 FPC连接器，上下都可以接触。

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2.5、 MIPI DSI

MIPI DSI接口采用的是 40Pin 0.5MM间距 FPC连接器，支持上下都可接触。连接器在Bottom层。

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2.6、TTL 串口

支持4组 3.3V电平的 TTL UART口，连接器使用的是2.0MM 4Pin Wafer连接器。

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2.7、音频接口

音频的录音和放音是通过RK809-5自带的Codec实现的。并通过3.5MM 3段式耳机座输入和输出，也预留的1.25MM间距的连接器作为备用输出。绿色耳机座为声音输出，红色耳机座为麦克风输入。

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耳机座接口定义：

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2.8、 RS232\RS485\12V 输出

RS232/GPIO/12V输出接口为3.5MM 双层凤凰连接器，RS485未3.5MM单层凤凰连接器，接口定义：

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2.9、PCIE 3.0

PCIE 3.0 接口使用的是M.2 M-key 连接器，可以接SSD及其他功能扩展。仅支持 80MM长的扩展卡。

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2.10、 MINI PCIE

此接口是4G LET模块扩展接口，可以通过插入MINI PCIE封装的4G LET模块，来实现4G网络（只能上网，不能打电话）

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2.11、 四麦阵列

此接口是四麦阵列接口，可以通过外接麦克风小板，实现四麦阵列功能

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1. Interface Diagram

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2. Port Description

2.1 LVDS Interface

The LVDS interface supports 4-lane and 8-lane displays. The power supply for LVDS displays can be selected from 12V, 5V and 3.3V.

2.11 LVDS Display Power Selection
 Select the appropriate power supply for the LVDS display via jumper caps.2.12 LVDS Interface Definition
 Connector: 2×15-pin header with 2.0mm pitch.

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2.2、 LVDS /EDP Power & Backlight

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2.3、 EDP Interface

2.31 The EDP connector is a 2×10-pin header with 2.0mm pitch. Interface definition is as follows:

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2.3 EDP Power Supply

The EDP power supply can be switched between 3.3V and 5V via resistors R2902 and R2903.
 

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2.4、 Camera for MIPI CSI

It supports two 2-Lane MIPI cameras, which can also be combined into a single 4-Lane camera.

The camera adopts a 24-pin FPC connector with 0.5mm pitch, featuring bidirectional contact.

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2.5、 MIPI DSI

The MIPI DSI interface uses a 40-pin FPC connector with 0.5mm pitch and supports bidirectional contact. The connector is placed on the bottom layer.

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2.6 TTL Serial Port

It supports four groups of 3.3V level TTL UART ports, equipped with 4-pin wafer connectors at 2.0mm pitch.

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2.7 Audio Interface

Audio recording and playback are implemented via the built-in CodeC of RK809-5. Audio input and output are available through a 3.5mm 3-segment audio jack. A spare connector with 1.25mm pitch is also reserved for backup output. The green jack is for audio output, and the red jack is for microphone input.

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Headphone Jack Interface Definition：

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2.8 RS232 / RS485 / 12V Output

The RS232, GPIO and 12V output adopt 3.5mm double-layer terminal block. The RS485 interface uses a 3.5mm single-layer terminal block. Interface definition is as follows:

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2.9、PCIE 3.0

The PCIe 3.0 interface adopts an M.2 M-key connector for SSD and other functional expansions. It only supports expansion cards with a length of 80mm.

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2.10、 MINI PCIE

This is an expansion interface for 4G LTE modules. It supports MINI PCIe form-factor 4G LTE modules to enable 4G network access (data service only, no voice call function).

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2.11、 Four-microphone Array

This interface is designed for four-microphone array. Connect an external microphone daughter board to enable the four-microphone array function.

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